@misc{Jakubowska_Małgorzata_Badanie_1993,
 author={Jakubowska Małgorzata},
 volume={21},
 editor={Kaczyński Łukasz},
 editor={Paduch Józef},
 number={2},
 copyright={Rights Reserved - Free Access},
 address={Warszawa},
 journal={Electronic Materials},
 howpublished={online},
 year={1993},
 publisher={ITME},
 language={pol},
 type={Text},
 title={Badanie adhezji warstw miedziowych metodą mikroanalizy rentgenowskiej = Investigations of copper films adhesion by x-ray microanalysis},
 URL={http://rcin.org.pl/Content/13670/PDF/WA901_14287_M1_r1993-t21-z2_Mater-Elektron-Jaku_i.pdf},
 keywords={Electronic - materials, Electronic - journal - materials, adhesion, copper film, x-ray microanalysis},
}