@misc{Olesińska_Wiesława_Diffusion_1994,
 author={Olesińska Wiesława},
 volume={22},
 number={2},
 copyright={Rights Reserved - Free Access},
 address={Warszawa},
 journal={Electronic Materials},
 howpublished={online},
 year={1994},
 publisher={ITME},
 language={eng},
 type={Text},
 title={Diffusion bonding of alumina to steel using copper interlayer},
 URL={http://rcin.org.pl/Content/13849/PDF/WA901_14361_M1_r1994-t22-z2_Mater-Elektroniczne_Olesinska_i.pdf},
 keywords={Electronic - materials, Electronic - journal - materials, diffusion bonding, ceramic-metal joint},
}