@misc{Kaliński_Dariusz_Naprężenia_2000,
 author={Kaliński Dariusz},
 volume={28},
 number={3},
 editor={Olesińska Wiesława},
 copyright={Rights Reserved - Free Access},
 address={Warszawa},
 journal={Electronic Materials},
 howpublished={online},
 year={2000},
 publisher={ITME},
 language={pol},
 type={Text},
 title={Naprężenia własne termiczne w spajanych elementach ceramiki AIN z miedzią = Thermal residual stresses in joined elements of AIN ceramics to copper},
 URL={http://rcin.org.pl/itme/Content/17643/PDF/WA901_15317_M1_r2000-t28-z3_Mater-Elektron-Kal_i.pdf},
 keywords={Electronic- materials, residual stress, ceramic metal joint, direct-bonding, Electronic - journal - materials},
}