Materiały Elektroniczne 2009 T.37 nr 1
Bibliogr. s. 72 ; 59-72 s. : il. 24 cm.
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Institute of Electronic Materials Technology
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Programme Innovative Economy, 2010-2014, Priority Axis 2. R&D infrastructure ; European Union. European Regional Development Fund
Oct 2, 2020
Jul 12, 2012
586
https://rcin.org.pl/itme/publication/16208
Edition name | Date |
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Borecki Janusz, Analysis blind microvias forming process in multilayer printed circuit boards | Oct 2, 2020 |
Stankiewicz, Rafał.